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Thermal conductivity and compressive properties of hollow glass microsphere

2021-01-05 13:10:50 51

The density, thermal conductivity, and compressive properties of hollow glass microsphere - filled epoxy composites were investigated in the present paper. The volume fraction of hollow glass microsphere was varied from 0 to 50 vol.%.

The results showed density, thermal conductivity, compressive modulus, and compressive strength of the composites decreased with the increase of hollow glass microsphere volume fraction, which indicated that the properties related above were mainly dependent on the content of hollow glass microsphere.

To conveniently predict thermal conductivity in the investigated materials system, five effective thermal conductivity models were analyzed and compared with the experimental data.

The Agari model was applied to predict thermal conductivity of hollow glass microsphere - filled epoxy composites, and the results indicated thermal conductivity and compressive properties of epoxy–matrix composites can be modified by changing the hollow glass microsphere volume fraction, this discover would make it become a promising engineering material in the related fields.

This article comes from sagepub edit released