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New Hollow Glass Microspheres Compounds Provide Weight Control

2019-07-30 14:45:21 411

We announces the availability of specialty compounds containing hollow glass microspheres which reduce part weight, enhance properties and lower part costs in demanding applications.

High loadings of these microspheres, can be added to thermoplastics to reduce overall part weight, and thus per part material costs. Additionally, they can modify polymer characteristics, achieving lower viscosity, improved flow, and reduced shrinkage and warpage.

For example, some compounds containing hollow glass microspheres can have their specific gravity reduced by as much as 30 percent. The use of hollow glass microspheres also provides more uniform control and reproducibility than other methods typically used for weight reduction, such as foaming agents.

Hollow glass microspheres reduce thermal conductivity and lower dielectric constants of most thermoplastics. Non-combustible and non-porous, the hollow glass microspheres do not absorb moisture. Compounds containing hollow glass microspheres are available in most engineering resins and easily adapt to common processing methods, including injection molding and extrusion. Applications that can benefit from this weight saving technology exist in the aerospace, automotive, marine, electronic, and medical industries.

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