A type of buoyancy material with excellent temperature resistance was successfully prepared through a molding method, and the hollow glass microspheres and silicon oxide (SiO2) were used as the filler and the matrix, respectively. The effect of sintering temperature on mechanical performance, microstructure, and high-temperature performance of the hollow glass microspheres/SiO2 composite were investigated in the study.
The hollow glass microspheres/SiO2 composite exhibited low density (0.47–0.53 g/cm³), high porosity (66.7–75.6%), low thermal conductivity (0.18–0.27 W/(m·K)), and relatively high compressive strength (3.8–5.2 MPa) properties. The values of Weibull moduli m used to predict the variation degree of compressive strength during the compression process was in the range of 5–15 and its values for the samples sintered at 850 °C was 14.64. Two stages namely elastic stage and fracture stage were shown in the stress-strain curves and in the elastic stage, the stress increased linearly with increasing of the strain until reaching the maximum stress.
In the fracture stage, the sample gradually destroyed with further increasing of the strain until complete failure. The compressive strength of the hollow glass microspheres/SiO2 composites tested at high-temperature was larger than that of the one tested at room temperature. The hollow glass microspheres/SiO2 composite exhibited low density, low thermal conductivity and excellent temperature resistance properties and can be used as the structural material or buoyancy material in the deep sea field in the near future.